SMT Solution to Coplanarity Interconnection for Power Modules and PCB- based Subassemblies Solderball PinTM Technology employs a highly conductive copper pin that incorporates a solder ball on the end that interfaces to the host PCB, providing additional solder to compensate for the coplanarity variation on the SMT board to board interconnection. Now in stock at KENSINGTON ELECTRONICS! FEATURES AND BENEFITS: Automatic coplanarity compensation: 0.020" High current carrying capability: 20A DC Converts through hole device into SMT Conducts heat from device to Host PCB
Please request your free solderball sample kit by completing the form below. All the information must be filled in for us to be able to send your kit to you.

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